Numerical Assessment of Thermal Effects in Bundled Overhead Conductors for Dynamic Line Rating
Applied Sciences (Switzerland), cilt.15, sa.18, 2025 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 15 Sayı: 18
- Basım Tarihi: 2025
- Doi Numarası: 10.3390/app151810210
- Dergi Adı: Applied Sciences (Switzerland)
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Agricultural & Environmental Science Database, Applied Science & Technology Source, Communication Abstracts, INSPEC, Metadex, Directory of Open Access Journals, Civil Engineering Abstracts
- Anahtar Kelimeler: ampacity estimation, bundled conductor, dynamic line rating, overhead transmission lines
- Süleyman Demirel Üniversitesi Adresli: Evet
Özet
Featured Application: The proposed numerical methodology allows transmission system operators to assess the thermal and current-carrying capacity of overhead lines, accounting for single and bundled conductor configurations. Bundle-specific effects, which are neglected in traditional standards (IEEE and CIGRE) calculations, are incorporated to provide more accurate dynamic line rating evaluations. This approach can support real-time ampacity management, operational planning, contingency analysis, and transmission line optimization, offering a scalable framework for diverse networks. Dynamic Line Rating (DLR) is increasingly important for maximizing capacity of existing overhead transmission lines. Conventional thermal rating methods, such as IEEE 738 and model conductors as single, isothermal cylinders and offer limited guidance for multi-conductor bundles, not fully capturing the complex aerodynamic and thermal interactions present in high-voltage networks. This study addresses these limitations by presenting a high-fidelity, two-dimensional coupled thermal-fluid model developed in COMSOL Multiphysics 4.3b. Single and bundled configurations (two-conductor, three-conductor and four-conductor) are analyzed under steady-state conditions using the Shear Stress Transport (SST) turbulence model, accounting for sub-conductor spacing, wind speed, and interactions between temperature distribution and airflow. Simulation results are compared with ampacity calculations from relevant standards to evaluate limitations of simplified models. Results show that leeward conductors reach temperatures up to ~4 °C higher than windward conductors, forming the thermal bottleneck, with peak temperatures of ~103.3 °C versus ~99 °C for single conductors. For bundled conductors, the current required to keep the maximum temperature at 100 °C was calculated, and this value was found to be approximately 3% lower than the current predicted by IEEE 738. The study emphasizes the importance of multiphysics, position-aware simulations to prevent overloading and optimize transmission line utilization.